Epoxy resin composition

ABSTRACT

An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

This application is a continuation-in-part of application Ser. No.916,934 filed on October 7, 1986, and now abandoned.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to epoxy resin compositions which aresuitable for use as molding materials, powder coating materials,encapsulators for semiconductors and the like.

2. Description of the Prior Art

Epoxy resin composition comprising epoxy resins and inorganic fillershave better characteristics, e.g. moldability, adhesiveness, electriccharacteristics, mechanical characteristics, moisture proofness and thelike, than other thermosetting resins. Accordingly, epoxy resincompositions have wide utilities as various molding materials, powdercoating materials and electric insulating materials, particularly asencapsulators for semiconductors.

However, most known epoxy resin compositions tend to crack upon curing,so that the appearance of the moldings and coatings is impeded andsemiconductor elements or devices become defective.

In order to solve the above problems, the present inventors haveproposed epoxy resin composition having a high resistance to cracking inwhich block copolymers of aromatic polymers and organopolysiloxanes areadded to curable epoxy resins (Japanese patent application Laid-Open No.58-21417). However, there is a high demand for epoxy resin compositionswhich have a high resistance to cracking, a high glass transition pointand a low coefficient of expansion, so that the degree of deformationupon molding is small with good moldability without sacrificingmechanical characteristics such as bending strength, a modulus ofelasticity in flexure, mechanical strength and the like.

Japanese Patent Publication No. 49-49176, Japanese patent applicationLaid-Open No. 59-129252, Japanese patent application Laid-Open No.60-69129 and Australian Pat. No. 235757 disclose epoxy resincompositions containing an organopolysiloxane.

SUMMARY OF THE INVENTION

It is, accordingly, an object of the present invention to provide anepoxy resin composition which has, without sacrificing mechanicalstrength such as bending strength and modulus of elasticity in flexure,low coefficient of expansion, high glass transition point and highresistance to cracking with a reduced degree of deformation at the timeof molding.

In order to achieve the above object, the present inventors madeintensive studies on copolymer components which can bring about a goodeffect on the cracking resistance by incorporating into epoxy resincompositions, curable epoxy resins and curing agents as prominentcomponents. As a result, it was found that copolymers obtained by theaddition of organopolysiloxanes containing .tbd.SiH groups to aromaticpolymers containing one or more epoxy groups and one or more alkenylgroups and copolymers obtained by the addition of organopolysiloxaneshaving amino groups to aromatic polymers containing one or more epoxygroups exhibit good characteristics as formulation agents for epoxyresin compositions. These copolymers contain little or no freeorganopolysiloxanes which are not bonded to epoxy resins. In addition,the copolymers have a varying solubility parameter after formation bythe reaction depending on the type of polymer. In a case whereorganopolysiloxane having a relatively low molecular weight of from 1500to 5000 are used, the solubility parameter is approximately in the rangeof from 7.3 to 8.5. Accordingly, the solubility in curable epoxy resinscan be prevented by the use of such copolymers. When the copolymers areformulated in epoxy resin compositions, the resultant composition notonly has a glass transition point which does not lower but increasesapproximately by 10° C., but also a low coefficient of expansion. Inaddition, the copolymers contain the same or similar epoxy resinsegments as curable epoxy resins and have thus a high affinity for thecurable epoxy resin. This permits microscopic dispersion with adrastically improved resistance to cracking. Such a composition ensuresa small degree of deformation of aluminium electrodes in a case in whichthe composition is used as an encapsulator for a semiconductor. Thepresent invention is accomplished based on the above findings.

According to the present invention, there is provided an epoxy resincomposition which comprises a curable epoxy resin, a curing agent, aninorganic filler and a copolymer selected from the group consisting of[A] a copolymer obtained by an addition reaction between an aromaticpolymer containing one or more epoxy groups and one or more alkenylgroups and an organopolysiloxane of the following formula (1) ##EQU1##in which R represents a substituted or unsubstituted monovalenthydrocarbon group, "a" is a value of from 0.01 to 0.1, "b" is a value offrom 1.8 to 2.2 and 1.81<a+b<2.3, and the number of silicon atoms in amolecule is an integer of from 20 to 400 and the number of hydrogenatoms directly connected to silicon atoms is an integer of from 1 to 5;[b] a copolymer obtained by an aromatic polymer containing one or moreepoxy groups and an amino group-containing organopolysiloxane of thefollowing formula (2) ##STR1## in which R¹ represents a divalent organicgroup, R² represents a monovalent organic group, "a" is a value of from0.01 to 0.1, "b" is a value of from 1.8 to 2.2 and 1.81<a+b<22.3, andthe number of silicon atoms in a molecule is an integer of from 20 to400.

The epoxy resin composition of the present invention comprises, asidefrom a curable epoxy resin, a curing agent and an inorganic filler,copolymer [A] obtained by an addition reaction between an aromaticpolymer containing one of more epoxy groups and one of more alkenylgroups and an organopolysiloxane with a .tbd.SiH structure having aspecific degree of polymerization and/or copolymer [B] obtained by anaddition reaction between an aromatic polymer containing one or moreepoxy groups and an amino group-containing organopolysiloxane having aspecific degree of polymerization. By the incorporation of thesecopolymers the epoxy resin composition is characterized with a lowcoefficient of expansion, a high glass transition point, a highresistance of to cracking and a very small degree of deformation ofaluminium electrodes without reduction of mechanical strengths such as abending strength, and a modulus of elasticity in flexure. Such acomposition is particularly suitable for use as molding materials,powder coating materials and encapsulators for semiconductors.

DETAILED DESCRIPTION OF THE INVENTION

Curable epoxy resins which are useful in the present invention are epoxyresins which have two or more epoxy groups in one molecule thereof. Theepoxy resins are not critical with respect to their molecular structure,molecular weight and the like so far as they are cured by means of avariety of curing agents described later. In this sense, a number ofcurrently known epoxy resins may be used for the purpose of the presentinvention. Examples of the epoxy resins include epoxy resins prepared,for example, from various type of novolac resins including bisphenol andepichlorohydrin, alicyclic epoxy resins, epoxy resins having haolgenatoms such as chlorine, bromine or the like introduced thereinto, andthe like. Among these, epoxidized novolac resins and epoxidizedbisphenol A resins are preferred. The epoxy resin may preferably have anepoxy equivalent of 140 to 350, more preferably 160 to 220. The epoxyresins may be used singly or in combination.

These epoxy resins may be used in combination with monepoxy resins.Examples of the monoepoxy resins include styrene oxide, cyclohexeneoxide, propylene oxide, methyl glycidyl ether, allyl glycidyl ether,octylene oxide, dodecene oxide and the like.

The curing agents may be amine curing agents such as, for example,diaminodiphenylmethane, diaminodiphenylsulfone, methaphenylenediamineand the like, acid anhydride curing agents such as, for example,phthalic anhydride, pyromellitic anhydride, benzophenonetetracarboxylicanhydride and the like, and phenol novolac curing agents having two ormore hydroxyl groups in the molecule thereof such as, for example,phenol novolac, cresol novolac and the like. Among these, phenol novolacand cresol novolac curing agents are preferred.

In the practice of the present invention, a variety of curing promotorsmay be used in order to promote the reaction between the curing agentand the epoxy resin. Examples of the promotors include imidazoles ortheir derivatives, tertiary amine derivatives, phosphine derivatives,cycloamidine derivatives and the like.

The curing agent is used in amounts ordinarily used for these purposes,although the amount of the curing agent may preferably be 20 to 100%based on the equivalent of the epoxy group of the epoxy resin, and theamount of a curing promotor may be within a range ordinarily used.

When an amount of the inorganic fillers used in the present invention isnot larger than 100 parts by weight per 100 parts by weight of the totalof the epoxy resin and curing agent, the resulting epoxy resincomposition may, in some cases, have a low stress and may not showsatisfactory results with respect to physical characteristics such as acracking resistance. On the other hand, when the amount exceeds 1000parts by weight, the fluidity becomes poor, so that the dispersion ofinorganic filler may become difficult. Accordingly, the amount ispreferred to be in the range of from 100 to 1000 parts by weight, morepreferably from 250 to 750 parts by weight. The inorganic fillers arenot critical with respect to the type and may be used singly or incombination. The fillers should be properly selected depending on thepurpose of the epoxy resin composition. For instance, natural silicasuch as crystalline silica or non-crystalline silica, synthetic highlypure silica, snythetic spherical silica, talc, mica, silicon nitride,boron nitride, alumina and the like are used singly or in combination.

The copolymer formulated in the epoxy resin composition of the presentinvention is one or more copolymers selected from [A] reaction productsobtained by an addition reaction between aromatic polymers containingone or more epoxy groups and one or more alkenyl groups andorganopolysiloxane of the following formula (1) ##EQU2## in which Rrepresents a substituted or unsubstituted monovalent hydrocarbon group,"a" is a value of from 0.01 to 0.1, preferably 0.01 to 0.05, "b" is avalue of from 1.8 to 2.2, preferably 2.0 to 22.1 and 1.81<a+b<2.3,preferably 2.01<a+b<2.05, and the number of silicon atoms in a moleculeis an integer of from 20 to 400, preferably 30 to 300 and the number ofhydrogen atom directly connected to a silicon atom is an integer of from1 to 5, preferably 2 to 3; and [B] reaction products obtained byaromatic polymers containing one or more epoxy groups and aminogroup-containing organopolysiloxanes of the following formula (2)##STR2## in which R¹ represents a divalent organic group, R² representsa monovalent organic group, "a" is a value of from 0.01 to 0.1,preferably 0.01 to 0.05, "b" is a value of from 1.8 to 2.2, preferably2.0 to 2.1 and 1.8l<a+b<2.3, preferably 2.01<a+b<2.05, and the number ofsilicon atoms in a molecule is an integer of from 20 to 400, preferably30 to 300.

The aromatic polymers containing one or more epoxy groups and one ormore alkenyl groups used to prepare copolymer [A] should preferably have1 to 11, more preferably 2 to 7 epoxy groups and 1 to 5, more preferably1 to 2 alkenyl groups such as vinyl groups and allyl groups in onemolecule. The polymers may have an epoxy equivalent of 140 to 350,preferably 150 to 250. Preferred polymers are epoxidized phenol novolacresins having one or more alkenyl groups and epoxidized cresol novolacresins having one or more alkenyl groups.

The polymer may be obtained by epoxidizing an alkenyl group-containingphenolic resin with epichlorohydrin or by partial reaction of2-allylphenol with a known epoxy resin.

Examples of the polymer are compounds of following formula (3),particularly formula (4). The compounds of formulae (5) to (7) are alsopreferred. ##STR3## In above formulae (3) to (7), R' represents hydrogenatom, a halogen atom such as chlorine atom and bromine atom, amonovalent hydrocarbon group having 1 to 8 carbon atoms such as an alkylgroup, and a glycidyl ether group shown as ##STR4## G represents aclycidyl ether group shown as ##STR5## p is an integer of 0 to 20, p' isan integer of 0 to 10, q is an integer of 1 to 20, q' is an integer of 1to 3, and t is 0 or 1.

The organopolysiloxanes represented by formula (1) may be any compoundhaving at least one .tbd.SiH group in one molecule. Inorganopolysiloxane (1), the substituted or unsubstituted monovalenthydrocarbon group should preferably have 1 to 10 carbon atoms andincludes an alkyl group having 1 to 10 carbon atoms such as a methylgroup, an ethyl group and the like, an aryl group having 6 to 10 carbonatoms such as a phenyl group and the like, an alkoxy group having 1 to 5carbon atoms such as a methoxy group, an ethoxy group and the like, andsubstituted alkyl and aryl groups in which one or more hydrogen atomsare substituted with a hologen atom, such as ClC₃ H₆ --, ##STR6## andthe like. The introduction rate of the alkoxy group in R of the formula(1), may be from 0 to 10 mole %. Among these, a methyl group and aphenyl group are preferred. Preferably, hydrogen-terminated dimethylpolysiloxane, hydrogen-terminated methylphenyl polysiloxane,hydrogen-terminated (2-trimethoxysilylethyl)-polysiloxane and the likeare used. Specific examples include compounds of following formulae (8)to (12) ##STR7##

The organopolysiloxanes of the formula (1) has generally a degreepolymerization "N" of from 20 to 400, preferably from 30 to 300, morepreferably from 30 to 200. In the case where "N" is in less than 20, itis difficult to impart adequate flexibility and a high glass transitionpoint (Tg), whereas when "N" is over 400, preparation of the copolymersis technically very difficult. In the event that copolymers areobtained, they cannot be readily dispersed, making it difficult toattain the purposes of the present invention.

In general, as "N" increases, organopolysiloxanes show better resultswith respect to the cracking resistance and glass transition point forthe same silicon content, but tend to be lower in dispersability andadhesiveness to elements. In order to improve the dispersability and theadhesiveness to elements, it is effective and, in fact, preferable tointroduce into side chains as shown in the formula (11) the followinggroups, e.g., ##STR8## The introduction rate may be 0 to 10 mole % inthe R of the formula (1).

Copolymers [A] can be obtained by thermal reaction between an aromaticpolymer containing one or more epoxy groups and one or more alkenylgroups and an organopolysiloxane of formuls (1) having an .tbd.SiH groupin the presence of a known addition catalyst, e.g. a platinum catalystsuch as chloroplatinic acid. Preferably, copolymer [A] should not bemiscible with an epoxy resin in the epoxy resin composition and take afine island structure in order that the resultant epoxy resincomposition has a high glass transition point, a low coefficient ofexpansion and a high cracking resistance. In this sense, copolymer [A]is preferred to have a solubility parameter of from 7.3 to 8.5, morepreferably from 7.6 to 8.2. In order to obtain a copolymer whosesolubility parameter is within the above range, when the equivalence of.tbd.SiH in the organopolysiloxane is taken as X and the molecularweight of the aromatic polymer is taken as Y, the reaction is preferablycarried out in the range of 0.7<X/Y<7.0.

The aromatic polymer having one or more epoxy groups used to obtaincopolymer [B] should preferably have 1 to 11, more preferably 2 to 7 ofepoxy groups in one molecule. The polymers may have an epoxy equivalentof 140 to 350, preferably 150 to 250. Novolac epoxy resins which areobtained, for example, from various novolac resins including bisphenoland epichlorohydrin, and alicyclic resins are preferably used. Inaddition, the curable epoxy resins as indicated before may be also usedfor this purpose. The most preferred polymers are epoxidized phenolnovolac resins and epoxidized cresol novolac resins.

The amino group-containing organopolysiloxanes represented by formula(2) may be organopolysiloxanes having at least one amino group in themolecule thereof. It is preferred that in formula (2), the divalentorganic group of R¹ has 1 to 10 carbon atoms and includes methylenegroup, ethylene group, propylene group, butylene group and the like. Thepropylene group is most preferred. The monovalent organic group of R²preferably has 1 to 10 carbon atoms and includes an alkyl group having 1to 10 carbon atoms such as methyl group and ethyl group, an alkoxy grouphaving 1 to 5 carbon atoms, and an aryl group having 6 to 10 carbonatoms such as the phenyl group. The combination of methyl group andphenyl group or methyl group and --CH₂ CH₂ Si(OCH₃)₃ is most preferred.As the organopolysiloxane, γ-aminopropyldimethylsiloxy-blockeddimethylpolysiloxane is also preferably used. Specific examples includecompounds of following formulae (13) to (16) ##STR9##

The amino group-containing organopolysiloxanes of formula (2) havegenerally a degree of polymerization "N" of from 20 to 400, preferablyfrom 30 to 300, more preferably from 30 to 200. If "N" is less than 20,the resultant composition is not imparted with satisfactory flexibilityand a high glass transition point (Tg). On the contrary, when "N"exceeds 400, it is technically very difficult to obtain copolymers. Evenif copolymers are obtained, they cannot readily be dispersed, thusmaking it impossible to attain the purposes of the present invention.

In general, organopolysiloxanes can give better results with respect tothe cracking resistance and the tendency toward a high glass transitionpoint as "N" increases for the same silicon level. However, thedispersability and the adhesiveness to elements tend to lower. In orderto improve the dispersability and the adhesiveness to elements, it ispreferred that not only a methyl group but also a propyl or a phenylgroup be introduced as the organic group represented by R².Alternatively, part of R² should preferably be a group such as ##STR10##

These amino group-containing organopolysiloxanes can be obtained bysubjecting a starting material such as, ##STR11## to a knownequilibration reaction to give a polymer and further subjectingHSi(OCH₃)₃ to an addition reaction with the polymer.

Copolymer [B] is obtained by mixing an aromatic polymer containing oneor more epoxy groups as indicated before and an amino group-containingorganopolysiloxane at a normal temperature or a high temperature andsubjecting the mixture to addition reaction. In order to mix bothstarting materials uniformly or substantially uniformly in the reaction,it is preferred to use a solvent such as methyl isobutyl ketone,toluene, dioxane, methyl cellosolve ® or the like. Preferably, thereaction should be accelerated by using water, alcohols such as butanol,isopropyl alcohol, ethanol and the like, or phenols or by using, as acatalyst for the reaction, amines such as tributylamine,1,8-diazabicycloundecene-1 and the like, organic phosphines such astriphenylphosphine, or imidazoles such as 2-phenylimidazole. Preferably,copolymer [B] should not be miscible with a curable epoxy resincontained in the epoxy resin composition and take a fine islandstructure in order that the epoxy resin composition has a high glasstransition point, a low coefficient of expansion and a high resistanceto cracking. To this end, the solubility parameter of the copolymer hasgenerally from 7.3 to 8.5, preferably from 7.6 to 8.2. For thepreparation of the copolymer having such a solubility parameter asdefined above, when an equivalent of the amine in the organopolysiloxaneis taken as X and the molecular weight of the aromatic polymer is takenas Y, the reaction should preferably be conducted within a range0.7<X/Y<7.0.

When the amount of the copolymers in the epoxy resin composition is lessthan 1 part by weight per 100 parts by weight of the total of an epoxyresin and a curing agent, the resultant epoxy resin composition is notsatisfactorily improved in the glass transition point and the crackingresistance and may not have a good effect on the suppression of analuminum wiring from movement in cases in which the composition is usedas an encapsulator for a semiconductor device. Over 100 parts by weight,the mechanical strength of the resulting epoxy resin composition tendsto become lowered. Accordingly, the amount may be in the range of from 1to 100 parts by weight, preferably from 2 to 60 parts by weight.

If necessary, the composition of the present invention may furthercomprise various additives which depend on the purpose and the field ofapplication. For instance, release agents such as waxes, fatty acidsincluding stearic acid and metal salts thereof, pigments such as carbonblack, dyes, antioxidants, flame retardants, surface treating agentssuch as γ-glycidoxypropyltrimethoxysilane, and other additives may beused.

The composition of the present invention is obtained by mixingpredetermined amounts of the afore-indicated ingredients underagitation, kneading the mixture by means of a kneader, rolls or anextruder preheated to 70° to 95° C., cooling and pulverizing themixture. The order of addition of the respective ingredients is notcritical.

The epoxy resin composition of the present invention may be suitableused as molding materials and powder coating materials. In addition, thecomposition is effectively used for encapsulating semiconductor devicessuch as ICs, LSIs, transistors, thyristors, diodes and the like and formanufacture of printed circuits.

For encapsulating semiconductor devices, conventionally employed moldingtechniques such as, transfer molding, injection molding and castingtechniques may be used. Preferably, the molding temperature for theepoxy resin composition is in the range of from 150° to 180° C. and thepost curing is effected at a temperature of from 150° to 180° C. for 2to 16 hours.

The preparatory examples of the copolymers used in the present inventionare shown, in which Preparatory Examples 1 and 2 are for copolymers [A],Preparatory Examples 3 are for comparison, and Preparatory Examples 4 to6 are for copolymers [B].

PREPARATORY EXAMPLE 1

A one liter four neck flask equipped with a reflux condenser, athermometer, an agitator and a dropping funnel was provided, in which300 g of an epoxidized phenol novolac resin (epoxy equivalent 195) wascharged. Thereafter, while agitating at 110° C., a mixture of 32 g of2-allylphenol and 1 g of tributylamine was dropped in 10 minutes,followed by continuing agitation at a temperature of 110° C. for further2 hours. The resulting content was subjected to distillation underreduced pressure to remove unreacted 2-allylphenol and tributylaminetherefrom, thereby obtaining an aromatic polymer containing epoxy groupsand allyl groups [allyl group-containing epoxy resin (allyl equivalent1490, epoxy equivalent 235)].

Subsequently, there were introduced into a four neck flask of the sametype as used above 120 g of the aromatic polymer obtained above, 100 gof methylisobutyl ketone, 200 g of toluene, and 0.04 g of2-ethylhexanol-modified chloroplatinic acid, followed vby azeotropicdehydration for 1 hour. Thereafter, 80 g of organopolysiloxanesindicated in Table 1 were, respectively, dropped at a refluxingtemperature in 30 minutes and agitated for reaction at the sametemperature for 4 hours. The resulting product was washed with water andthe solvent was distilled off under reduced pressure to obtain reactionproducts (copolymers I, II, and III).

                  TABLE 1                                                         ______________________________________                                                Copolymer I                                                                            Copolymer II                                                                              Copolymer III                                    ______________________________________                                        Starting  (note 1)   (note 2)    (note 3)                                     organopoly-                                                                             compound   compound (18)                                                                             compound (19)                                siloxane  (17)                                                                Appearance                                                                              light yellow                                                                             whitish     whitish                                                transparent                                                                              yellow      yellow                                                 solid      opaque solid                                                                              opaque solid                                 Melt viscosity                                                                          650        760         890                                          (cps, 150° C.)                                                         Loss in weight                                                                          0.42       0.56        0.45                                         on heating (%,                                                                150° C., 1 hr)                                                         ______________________________________                                         (Note 1)                                                                      Compound (17):                                                                ##STR12##                                                                     (Note 2)                                                                      Compound (18):                                                                ##STR13##                                                                     (Note 3)                                                                      Compound (19):                                                                ##STR14##                                                                

PREPARATORY EXAMPLE 2

A four neck flask of the same type as used in Preparatory Example 1 wasused, in which there were placed 200 g of an allyl glycidylether-modified phenol novolac resin having a softening point of 100° C.(phenol equivalent 125, allyl equivalent 1100), 800 g ofchloromethyloxysilane and 0.6 g of cetyl trimethylammonium bromide. Themixture was heated and mixed under agitation at a temperature of 110° C.for 3 hours. The mixture was cooled down to a temperature of 70° C. and,after reduction to a pressure of 160 mmHg, 128 g of an aqueous 50%sodium hydroxide solution was dropped into the mixture in 3 hours underazeotropic dehydration. The content was reduced in pressure to removethe solvent by distillation and dissolved in a mixed solvent of 300 g ofmethyl isobutyl ketone and 300 g of acetone, followed by washing withwater and distilling the solvent off under reduced pressure to obtain anaromatic polymer containing epoxy groups and allyl groups [allylgroup-containing epoxy resin (allyl equivalent 1590, epoxy equivalent190)]. Organopolysiloxanes indicated in Table 2 were used, followed bythe procedure of Preparatory Example 1 to obtain reaction productsindicated in Table 2 (copolymers IV, V).

                  TABLE 2                                                         ______________________________________                                                     Copolymer IV                                                                             Copolymer V                                           ______________________________________                                        Starting       compound (17)                                                                              compound (18)                                     organopolysiloxane                                                                           light yellow whitish                                           Appearance     transparent  yellow                                                           solid        opaque solid                                      Melt viscosity 530          660                                               (cps, 150° C.)                                                         Loss in weight                                                                on heating (%, 0.34         0.40                                              150° C., 1 hr)                                                         ______________________________________                                    

PREPARATORY EXAMPLE 3

The general procedure of Preparatory Example 1 was repeated except thatthere were used, instead of the aromatic polymer resin, anallylphenol-containing phenol novolac resin (phenol equivalent 125,allyl equivalent 1100) and organopolysiloxanes indicated in Table 2,thereby obtaining reaction products (copolymers VI, VII) indicated inTable 3.

                  TABLE 3                                                         ______________________________________                                                     Copolymer VI                                                                             Copolymer VII                                         ______________________________________                                        Starting       compound (17)                                                                              compound (18)                                     organopolysiloxane                                                                           brown        whitish                                           Appearance     transparent  yellow                                                           solid        opaque solid                                      Melt viscosity 1090         1330                                              (cps, 150° C.)                                                         Loss in weight                                                                on heating (%, 0.62         0.83                                              150° C., 1 hr)                                                         ______________________________________                                    

PREPARATORY EXAMPLE 4

A one liter four neck flask equipped with a reflux condenser, athermometer, an agitator and a dropping funnel was provided, in which150 g of an epoxidized cresol novolac resin (epoxy equivalent 200)having a softening point of 70° C., 150 g of 1,4-dioxane and 150 g ofn-butanol were placed. While agitating at a temperature of 83° C., 50 gof α, ω-bis (aminopropyl) dimethylpolysiloxane (compound of theafore-indicated formula (14)) having different degrees ofpolymerization, n, indicated in Table 4 was dropped in 2 hours, followedby agitation at the same temperature for further 6 hours for reaction.Thereafter, the content was subjected to distillation to remove thesolvent, thereby obtain reaction products (copolymers VIII-X).

                  TABLE 4                                                         ______________________________________                                                 Copolymer                                                                              Copolymer                                                            VIII     IX         Copolymer X                                      ______________________________________                                        The number, n, of                                                             starting organo-                                                                         50         100        300                                          polysiloxane                                                                             light yellow                                                                             whitish    whitish                                      Appearance transparent                                                                              yellow     yellow                                                  solid      opaque solid                                                                             opaque solid                                 Melt viscosity                                                                           990        1480       1920                                         (cps, 150° C.)                                                         Loss in weight                                                                on heating (%,                                                                           0.48       0.53       0.57                                         150° C., 1 hr)                                                         ______________________________________                                    

PREPARATORY EXAMPLE 5

A four neck flask of the same type as used in Preparatory Example 4 wasprovided, in which there were placed 150 g oftris(4-hydroxyphenyl)-methane triglycidyl ether (epoxy equivalent 150),150 g of toluene, 150 g of isopropyl alcohol, 10 g of water and 20 g ofamino group-containing organopolysiloxanes of the following formula (20)having degrees of polymerization, m and l, indicated in Table 5,followed by mixing under agitation and distilling off the solvent,thereby obtaining reaction products (copolymers XI to XIII) indicated inTable 5. ##STR15##

                  TABLE 5                                                         ______________________________________                                                  Copolymer                                                                              Copolymer  Copolymer                                                 XI       XII        XIII                                            ______________________________________                                        The numbers, m,                                                                           100        100        300                                         and l       0          2          0                                           of starting organo-                                                           polysiloxane                                                                  Appearance  white opaque                                                                             white opaque                                                                             white opaque                                            solid      solid      solid                                       Melt viscosity                                                                            1060       1220       1360                                        (cps, 150° C.)                                                         Loss in weight                                                                on heating (%,                                                                            0.37       0.45       0.67                                        150° C., 1 hr)                                                         ______________________________________                                    

PREPARATORY EXAMPLE 6

The general procedure of Preparatory Example 4 was repeated using,instead of α, ω-bis (aminopropyl) dimethylpolysiloxane, 50 g of an aminogroup-containing organopolysiloxane of the following formula (21),thereby obtaining a reaction product (copolymer XIV) indicated in Table6. ##STR16##

                  TABLE 6                                                         ______________________________________                                                        Copolymer XIV                                                 ______________________________________                                        Appearance        white opaque solid                                          Melt viscosity (cps, 150° C.)                                                            1930                                                        Loss in weight on 0.62                                                        heating (%, 150° C., 1 hr)                                             ______________________________________                                    

The present invention is more particularly described by way of examplesand comparative examples but these examples should not be construed aslimiting the present invention thereto. In examples and comparativeexamples, parts are by weight.

EXAMPLES 1-8 AND COMPARATIVE EXAMPLES 1-3

An epoxidized cresol novolac resin (curable epoxy resin I) having anepoxy equivalent of 200, a phenol novolac resin having a phenolequivalent of 110, the copolymers [A] obtained in Preparatory Examples,triphenylphosphine (TPP), and 1,8-diazabicycloundecene-7 (DBU) were usedin amounts indicated in Table 7. There were added to the respectivemixtures of 10 parts of a brominated epoxy novolac resin, 260 parts offuned silica powder, 1.5 parts of 3-glycidoxypropylmethoxysilane, 1.5parts of wax E and 1.0 part of carbon black. The resulting compositionwere each melted and mixed uniformly by means of two hot rolls to obtaineleven epoxy resin composition (Examples 1-8, Comparative Examples 1-3).

These epoxy resin compositions were subjected to the following tests (a)through (e).

(a) Spiral flow value:

A mold as prescribed in the EMMI standards was used and the test waseffected under conditions of 175° C. and 70 kg/cm².

(b) Mechanical strength (bending strength and modulus of elasticity inflexure)

According to the method prescribed in JIS K 6911, a bar having adimension of 10×4×100 mm, which was molded under conditions of 175° C.and 70 kg/cm² for molding time of 2 minutes and post-cured at 180° C.for 4 hours, was used for the measurement.

(c) Coefficient of expansion and glass transition temperature

A test piece having a size of 4 mmΦ×15 mm was used and subjected tomeasurement of the values by heating at a rate of 5° C. per minute bymeans of a dilatometer.

(d) Cracking resistance

A silicon chip having a dimension of 9.0×4.5×0.5 mm was adhered to a 14pin-IC frame (42 alloy), over which an epoxy resin composition wasmolded under conditions of 180° C.×2 minutes and post-cured at 180° C.for 4 hours, followed by a repeated heat cycle of -196° C.×1 minute and260° C.×30 seconds. After 50 cycles, the rate of occurrence of the resincrackings was measured (sample number is 50 for each compositions).

(e) Degree of deformation of an aluminium electrode

An aluminium electrode was vacuum deposited on a silicon chip having adimension of 3.4×10.2×0.3 mm to obtain an element for measuring thedegree of deformation. This element was bonded on a 14 pin-IC frame (42alloy) over which an epoxy resin composition was molded under moldingconditions of 180° C.×2 minutes and post-cured at 180° C. for 4 hours,followed by a repeated heat cycle of -196° C.×1 minute and 260° C.×30seconds. After 20 cycles, the degree of deformation of the aluminumelectrode was determined (sample number is 3 for each compositions).

The test results are shown in Table 7.

                  TABLE 7                                                         ______________________________________                                                       Example 1 Example 2 Example 3                                  ______________________________________                                        epoxy resin I (parts)                                                                        43        43        43                                         phenolic resin (parts)                                                                       31        31        31                                         copolymer I (parts)                                                                          16        --        --                                         copolymer II (parts)                                                                         --        16        --                                         copolymer III (parts)                                                                        --        --        16                                         copolymer IV (parts)                                                                         --        --        --                                         copolymer V (parts)                                                                          --        --        --                                         copolymer VI (parts)                                                                         --        --        --                                         copolymer VII (parts)                                                                        --        --        --                                         TPP (parts)    1.0       1.0       1.0                                        DBU (parts)    --        --        --                                         spiral flow (inches)                                                                         29        27        26                                         bending strength (kg/cm.sup.2)                                                               14.1      13.8      13.6                                       modulus of elasticity in                                                                     1150      1180      1200                                       flexure (kg/mm.sup.2)                                                         coefficient of expansion                                                                     1.7       1.7       1.7                                        (× 10.sup.-5 /°C.)                                               glass transition                                                                             170       168       170                                        temperature (°C.)                                                      cracking resistance (%)                                                                      0         0         0                                          degree of deformation of                                                                     0         0         0                                          Al electrode (μm)                                                          ______________________________________                                        Example              Comparative Example                                      4    5       6       7     8     1     2     3                                ______________________________________                                        42   42      43      27    33    56    52    52                               32   32      31      31    35    34    22    22                               --   --      --      --    --    --    --    --                               --   --      16      --    --    --    --    --                               --   --      --      --    --    --    --    --                               16   --      --      --    --    --    --    --                               --   16      --      32    32    --    --    --                               --   --      --      --    --    --    16    --                               --   --      --      --    --    --    --    16                               1.0  1.0     --      1.0   --    1.0   1.0   1.0                              --   --      1.0     --    1.0   --    --    --                               32   30      30      28    29    30    27    25                               14.5 14.0    13.7    13.5  13.2  13.5  12.6  12.9                             1230 1200    1140    1100  1120  1400  1250  1300                             1.7  1.7     1.7     1.7   1.7   1.8   1.9   1.9                              170  167     170     168   167   158   152   155                              0    0       0       0     0     100   46    38                               0    0       0       0     0     0.4   0.8   0.6                              ______________________________________                                    

As will be apparent from the results of Table 7, the epoxy resincompositions comprising copolymers [a] obtained by the reaction betweenepoxy resins and the specific types of organopolysiloxanes have not onlya coefficient of expansion equal to or less than the copolymer [A]-freeepoxy resin composition without impeding mechanical strengths such asthe bending strength and the modulus of elasticity in flexure, but alsohigher glass transition temperatures, better cracking resistances andsmaller degrees of deformation of the aluminium electrode. Thus theepoxy resin composition of the invention will be found to be suitable asa molding material, a powder coating material and an encapsulator forsemiconductors.

EXAMPLE 9-12

The general procedure of Example 1 was repeated using, instead of epoxyresin I, a novolac resin of epoxidized bisphenol A (epoxy resin II)having an epoxy equivalent of 220 or a tris(4-glycidoxyphenyl)methanedimer (epoxy resin III) having an epoxy equivalent of 195 andformulations of a phenolic resin and copolymers indicated in Table 8,thereby obtaining epoxy resin compositions. The epoxy resin compositionswere subjected to tests (a) through (e) in the same manner as in Example1.

The test results are also shown in Table 8.

                  TABLE 8                                                         ______________________________________                                                      Example                                                                       9    10       11     12                                         ______________________________________                                        epoxy resin II (parts)                                                                        45     --       44   --                                       epoxy resin III (parts)                                                                       --     42       --   41                                       phenolic resin (parts)                                                                        29     32       30   33                                       copolymer II (parts)                                                                          16     16       --   --                                       copolymer V (parts)                                                                           --     --       16   16                                       spiral flow (inches)                                                                          26     28       27   30                                       bending strength (kg/mm.sup.2)                                                                14.2   14.8     14.6 15.3                                     modulus of elasticity in                                                                      1200   1230     1140 1170                                     flexure (kg/mm.sup.2)                                                         coefficient of expansion                                                                      1.7    1.7      1.7  1.6                                      (× 10.sup.-5 /°C.)                                               glass transition                                                                              175    176      182  185                                      temperature (°C.)                                                      cracking resistance (%)                                                                       0      0        0    0                                        degree of deformation of                                                                      0      0        0    0                                        Al electrode (μm)                                                          ______________________________________                                    

As will be apparent from the results of Table 8, the epoxy resincompositions formulated with the copolymers [A] of the present inventionare not reduced in fluidity and mechanical strength and a lowcoefficient of expansion, a high glass transition temperature, a goodcracking resistance and a small degree of deformation of the aluminiumwiring.

EXAMPLES 13-21 AND COMPARATIVE EXAMPLES 4, 5

An epoxidized cresol novolac resin (curable epoxy resin IV) having anepoxy equivalent of 200, a phenol novolac resin having a phenolequivalent of 110, copolymers [B] prepared in Preparatory Examples,triphenyl phosphine (TPP) and 1,8-biazabicycloundecene-7 (DBU) wereformulated as shown in Table 9, to which 10 parts of a brominated epoxynovolac resin, 10 parts of antimony trioxide, 1.5 parts of3-glycidoxypropyltrimethoxysilane, 1.5 parts of wax E and 1.0 part ofcarbon black were added. The mixtures were uniformly melted and mixed bymeans of two hot rolls to obtain 11 epoxy resin compositions (Examples13-21 and Comparative Examples 4, 5).

The epoxy resin compositions were subjected to tests (a) through (e).The results are shown in Table 9 below.

                  TABLE 9                                                         ______________________________________                                                       Example                                                                         13        14     15                                          ______________________________________                                        epoxy resin (parts)                                                                            42        42     42                                          phenolic resin (parts)                                                                         32        32     32                                          copolymer VIII (parts)                                                                         16        --     --                                          copolymer IX (parts)                                                                           --        16     --                                          copolymer X (parts)                                                                            --        --     16                                          copolymer XI (parts)                                                                           --        --     --                                          copolymer XII (parts)                                                                          --        --     --                                          copolymer XIII (parts)                                                                         --        --     --                                          copolymer XIV (parts)                                                                          --        --     --                                          TPP (parts)      1.0       1.0    1.0                                         Promotor (parts) --        --     --                                          spiral flow (inches)                                                                           30        29     28                                          bending strength (kg/mm.sup.2)                                                                 14.3      14.5   14.0                                        modulus of elasticity in                                                                       1200      1230   1250                                        flexure (kg/mm.sup.2)                                                         coefficient of expansion                                                                       1.7       1.7    1.7                                         (× 10.sup.-5 /°C.)                                               glass transition 168       170    173                                         temperature (°C.)                                                      cracking resistance (%)                                                                        0         0      0                                           degree of deformation of                                                                       0         0      0                                           Al electrode (μm)                                                          mold releasability                                                                             o         o      o                                           ______________________________________                                                                  Comparative                                         Example                   Example                                             16    17      18      19    20    21    4     5                               ______________________________________                                        24    24      24      42    28    42    56    53                              32    32      32      32    30    32    34    31                              --    --      --      --    --    --    --    --                              --    --      --      16    32    --    --    --                              --    --      --      --    --    --    --    --                              34    --      --      --    --    --    --    --                              --    34      --      --    --    --    --    --                              --    --      34      --    --    --    --    --                              --    --      --      --    --    16    --    --                              1.0   1.0     1.0     --    1.0   1.0   1.0   1.0                             --    --      --      1.0   --    --    --    --                              33    31      31      30    28    28    30    24                              14.8  13.6    14.5    13.7  13.5  14.3  13.5  9.8                             1240  1280    1240    1180  1100  1260  1400  1050                            1.7   1.7     1.7     1.8   1.8   1.7   1.8   1.9                             169   170     174     170   173   172   158   165                             0     0       0       0     0     0     100   46                              0     0       0       0     0     0     0.4   0.6                             O     O       O       O     O     O     O     X                               ______________________________________                                    

As will be apparent from the results of Table 9, the epoxy resincompositions formulated with copolymers [B] obtained by the reactionbetween epoxy resins and amino group-containing organopolysiloxaneshaving a specific degree of polymerization (N=20-400) have, withoutreduction of mechanical strengths such as the bending strengths and themodulus of elasticity in flexure, a coefficient of expansion equal to orless than the copolymer [B]-free epoxy resin compositions, and also havea higher glass transition temperature, a better cracking resistance anda smaller degree of deformation of the aluminum electrode.

EXAMPLES 22-25

The general procedure of Example 13 was repeated except that there wasused, instead of epoxy resin IV, a novolac resin of epoxidized bisphenolA (epoxy resin V) having an epoxy equivalent of 220 ortris(4-glycidoxyphenyl) methane dimer (epoxy resin IV) having an epoxyequivalent of 195 and that the amounts of phenolic resin and copolymeswere as indicated in Table 10, thereby obtaining epoxy resincompositions. These compositions were subjected to tests (a) through(e).

The test results are shown in Table 10.

                  TABLE 10                                                        ______________________________________                                                      Example                                                                       22   23       24     25                                         ______________________________________                                        epoxy resin V (parts)                                                                         44     --       26   --                                       epoxy resin VI (parts)                                                                        --     41       --   23                                       phenolic resin (parts)                                                                        30     33       30   33                                       copolymer XIV (parts)                                                                         16     16       --   --                                       copolymer XI (parts)                                                                          --     --       34   34                                       spiral flow (inches)                                                                          28     30       30   32                                       bending strength (kg/mm.sup.2)                                                                14.6   14.1     14.5 14.9                                     modulus of elasticity in                                                                      1240   1200     1250 1180                                     flexure (kg/mm.sup.2)                                                         coefficient of expansion                                                                      1.7    1.7      1.7  1.7                                      (× 10.sup.-5 /°C.)                                               glass transition                                                                              179    187      182  188                                      temperature (°C.)                                                      cracking resistance (%)                                                                       0      0        0    0                                        degree of deformation of                                                                      0      0        0    0                                        Al electrode (μm)                                                          mold releasability                                                                            O      O        O    O                                        ______________________________________                                    

The results of Table 10 reveal that the epoxy resin compositionsformulated with the copolymers [B] according to the present invention donot lower in fluidity and mechanical strength and have a low coefficientof expansion, a high glass transition point, a good cracking resistanceand a small degree fo deformation of the aluminium wiring.

What is claimed is:
 1. An epoxy resin composition which comprises a curable epoxy resin, an epoxy resin agent, an inorganic filler, and a copolymer obtained by an addition reaction between aromatic polymers having one or more epoxy groups and one or more alkenyl groups and organopolysiloxanes of the following formula (1) ##EQU3## in which R represents a substituted or unsubstituted monovalent hydrocarbon group, "a" is a value of from 0.01 to 0.1, "b" is a value of from 1.8 to 2.2 and 1.81<a+b<2.3, and the number of silicon atoms in a molecule is an integer of from 20 to 400 and the number of hydrogen atoms directly connected to silicon atoms is an integer of from 1 to
 5. 2. The composition according to claim 1, wherein said curable epoxy resin is at least one resin selected from the group consisting of novolac epoxy resins and bisphenol a epoxy resins.
 3. The composition according to claim 1, the aromatic polymer having one or more epoxy groups and one or more alkenyl groups is an epoxidized phenol novolac resin containing one or more alkenyl groups or an epoxidized cresol novolac resin containing one or more alkenyl groups.
 4. The composition according to claim 1, wherein the organopolysiloxane of the formula (1) is at least one member selected from the group consisting of hydrogen-terminated dimethylpolysiloxane, hydrogen-terminated methylphenylpolysiloxane and hydrogen-terminated methyl (2-trimethoxysilylethyl) polysiloxane.
 5. the composition according to claim 1, wherein the copolymer is present in the amount of from 1 to 100 parts by weight per 100 parts by weight of the total of said curable epoxy resin and said curing agent.
 6. The composition according to claim 1, wherein said inorganic filler is present in the amount of from 100 to 1000 paarts by weight per 100 parts by weight of the total of said curable epoxy resin and said curing agent. 